Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:
The engineer will engage in hands-on investigations of flash memory devices, working directly with advanced lab equipment and collaborating with cross functional team to uncover the root causes of device failures and drive improvements in products.

• Define FA flow and execute detailed electrical and physical failure analysis for memory device, package, qualification, RMA, and technology-development failures.
• Perform fault isolation using electrical FA methods such as curve tracer analysis, oscilloscope-based debug, in-house tester data, and related diagnostic techniques.
• Conduct physical analysis using tools such as optical microscopy, chemical decapsulation, SEM/FESEM, FIB, TEM, EDX, and other applicable FA methods.
• Interpret circuit schematics, layouts, test results, and process history to support defect localization and failure-mechanism understanding.
• Develop clear failure models based on collected electrical and physical evidence and communicate findings through structured FA reports.
• Collaborate with product, test, process integration, design, reliability, and package engineering teams to close FA cases and support product improvement.
• Improve day-to-day FA methods, documentation, analysis consistency, and turnaround time within assigned projects.
• Support junior engineers by sharing FA techniques, tool knowledge, and best practices within the team.

Qualifications

Required
• Bachelor’s degree in electrical engineering, Electronics Engineering, Materials Science, Physics, or related engineering field; advanced degree preferred.
• Typically 5-8 years of relevant engineering experience, consistent with the E107 Engineering level framework.
• Strong foundation in semiconductor device physics, electronic circuits, memory product technology, package construction, and failure mechanisms.
• Hands-on experience with electrical and physical FA tools and ability to solve moderately complex engineering problems independently.
• Ability to write clear technical FA reports and communicate analysis results effectively in English.

Preferred
• Experience in IC or memory device failure analysis, memory IC de-processing, semiconductor assembly, SMT assembly, and product test methodology.
• Detail-oriented, organized, self-directed, and able to work effectively in a cross-functional engineering environment.

Skills:
• Interest in improving FA systems, procedures, and analysis methods for better quality and efficiency.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

 Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

 NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to SandiskEthicsHelpline at www.SandiskEthicsHelpline.com or by emailing us at compliance@sandisk.com

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